In recent discussions, there has been much speculation surrounding Huawei’s advancements in chip design and manufacturing, with some suggesting they were on the brink of rivaling top global chipmakers, particularly those based in the US. However, a recent report indicates that Huawei may not be as close to challenging leading chip manufacturers as previously thought.
The crux of the matter often revolves around the concept of manufacturing process nodes, which essentially refers to the size and efficiency of transistors on a chip. Smaller numbers, such as 5nm or even 2nm, signify more advanced technology. A higher transistor density typically results in improved performance and power efficiency, provided it is executed well. Earlier reports indicated that Huawei’s Kirin X90 processor, found in devices like the foldable MateBook, utilized a 5nm process.
However, recent information paints a different picture. The latest report suggests that the Kirin X90 actually utilizes SMIC’s 7nm process node, specifically the N+2 variant. To put this into perspective, this is the same chip technology found in last year’s Mate 70 series smartphones. This revelation is significant as it indicates that Huawei and SMIC are currently lagging two generations behind the cutting edge of chip technology, rather than the one-generation gap that some had optimistically posited.
The primary obstacle in Huawei’s path remains the stringent sanctions that prevent both Huawei and SMIC from acquiring Extreme Ultraviolet (EUV) lithography machines, which are crucial for producing chips at the 5nm process node and beyond. While there have been theories about achieving 5nm using older Deep Ultraviolet (DUV) machines through complex multi-impression techniques, such methods are notoriously challenging and often lead to lower yields, making mass production a formidable task.
Looking to the future, the gap is likely to widen further. Industry experts anticipate that flagship devices in the upcoming year, such as Apple’s forthcoming iPhone 18 line, will rely on even more advanced 2nm application processors. This continuous evolution in chip technology beyond Huawei’s grasp underscores the ongoing obstacles they encounter in catching up to the global leaders in semiconductor design and manufacturing.