The latest leaks have given us a sneak peek into the designs of the upcoming Google Pixel 11 Pro and Pro XL models. These devices are expected to hit the market in August 2026, featuring the powerful Tensor G6 chipset.
According to reports from Tech Advisor, the leaked CAD renders show that the Pixel 11 Pro and Pro XL designs closely resemble their predecessors, the Pixel 10 models. One noticeable change is the all-black camera bar, which replaces the previous metal section seen on the earlier models.
However, one key feature seems to be missing from the leaked designs – the unique infrared temperature sensor. This sensor, typically located within the camera bar, allowed users to measure the temperature of various objects using the Thermometer app. Its absence in the new designs may signify the removal of this distinctive Pixel feature.
Despite the missing temperature sensor, the overall design of the Pixel 11 Pro models remains largely unchanged from the Pixel 10 Pro. Both models are expected to maintain similar dimensions, with the Pro XL being slightly thinner at 8.5mm. Additionally, the frame of the devices is speculated to have a glossy finish, differentiating it from the matt finish metal of the entry-level model.
The leaked images also hint at the color options for the Pixel 11 Pro and Pro XL, although these are not yet confirmed. The Pro XL model is expected to be the same size as its predecessor, the Pixel 10 Pro XL, with only a slight decrease in thickness.
As we await the official launch of the Pixel 11 series in August 2026, questions remain regarding potential storage upgrades and price adjustments. It is speculated that Google may increase the base storage to 256GB and possibly implement a price hike, aligning with industry trends seen in other smartphone releases this year.
Overall, the Pixel 11 Pro and Pro XL promise to deliver a blend of familiar design elements with updated features, powered by the latest Tensor G6 chipset. Stay tuned for more updates as we approach the official launch date.